full pak high voltage npn power transistor for isolated package applications the but11af was designed for use in line operated switching power supplies in a wide range of end use applications. this device combines the latest state of the art bipolar fabrication techniques to provide excellent switching, high voltage capability and low saturation voltage. ? 1000 volt v ces rating ? low base drive requirements ? isolated overmold package ? improved system efficiency ? no isolating washers required ? reduced system cost ? high isolation voltage capability (4500 v rms ) maximum ratings rating symbol value unit collectoremitter sustaining voltage v ceo(sus) 450 vdc collectoremitter breakdown voltage v ces 1000 vdc emitterbase voltage v ebo 9.0 vdc rms isolation voltage (for 1 sec, per figure 7 v isol1 4500 t a = 25 c, rel. humidity < 30%) per figure 8 v isol2 3500 v per figure 9 v isol3 2500 collector current e continuous collector current e pulsed (1) i c i cm 5.0 10 adc base current e continuous base current e pulsed (1) i b i bm 2.0 4.0 adc total power dissipation @ t c = 25 c* derated above 25 c p d 40 0.32 watts w/ c operating and storage temperature range t j , t stg 65 to +150 c thermal characteristics thermal resistance e junction to case* r q jc 3.125 c/w maximum lead temperature for soldering purposes 1/8 from case for 5 sec. t l 260 c (1) pulse test: pulse width = 5.0 ms, duty cycle 10%. *measurement made with thermocouple contacting the bottom insulated mounting surface of the package (in a location beneath the die), the device mounted on a heatsink, thermal grease applied, and a mounting torque of 6 to 8 in . lbs. on semiconductor ? semiconductor components industries, llc, 2001 march, 2001 rev. 4 1 publication order number: but11af/d but11af power transistor 5.0 amperes 450 volts 40 watts case 221d02 to220 type
but11af http://onsemi.com 2 electrical characteristics (t c = 25 c unless otherwise noted) characteristic symbol min typ max unit off characteristics (1) collector-emitter sustaining voltage (figures 1 & 2) (i c = 100 madc, i b = 0, l = 25 m h) v ceo(sus) 450 vdc collector cutoff current (v ce = 1000 vdc, v be = 0) (v ce = 1000 vdc, v be = 0, t j = 125 c) i ces 1.0 2.0 madc emitter-base leakage (v eb = 9.0 vdc, i c = 0) i ebo 10 madc on characteristics (1) collector-emitter saturation voltage (i c = 2.5 adc, i b = 0.5 adc) v ce(sat) 1.5 vdc base-emitter saturation voltage (i c = 2.5 adc, i b = 0.5 adc) v be(sat) 1.5 vdc dc current gain (i c = 5.0 madc, v ce = 5.0 vdc) h fe 10 dynamic characteristics insulation capacitance (collector to external heatsink) cc-hs 15 pf switching characteristics inductive load (figures 3 & 4) storage t =25 c t s 1100 1400 ns fall time i =25adc i =05adc t j = 25 c t fi 80 150 storage i c = 2.5 adc, i b1 = 0.5 adc t = 100 c t s 1200 1500 fall time t j = 100 c t fi 140 300 resistive load (figures 5 & 6) turn-on time t on 1000 ns storage time i c = 2.5 adc, i b1 = i b2 = 0.5 adc t s 4000 fall time c , b1 b2 t f 800 (1) pulse test: pulse width = 300 m s , duty cycle 2.0%. 0 200 250 100 min v ceo(sus) v ce (v) figure 1. oscilloscope display for sustaining voltage i c (ma) hor. oscilloscope vert. oscilloscope +50 v l v in 0 t p t 100-200 w 1 w figure 2. test circuit for v ceo(sus)
but11af http://onsemi.com 3 v in 0 t p t r b r l t.u.t. v cc figure 3. test circuit resistive load v cc v in t p t p t = 250 v = -6 to +8 v = 20 m s = 0.01 90% 10% 90% 10% i b i c i b on i b off i c on t r t t d t on t off t s t f t figure 4. switching times waveforms with resistive load figure 5. test circuit inductive load +i b1 -v be l b v cc l c v cl t.u.t. 7z89211.2 v cl v cc v eb l b v cl = 300 v = 30 v = 5 v = 1 m h = 200 m h figure 6. switching times waveforms with inductive load 90% 10% 90% 10% i b i c i b1 i b2 i c on t r t f t s t off t
but11af http://onsemi.com 4 test conditions for isolation tests* mounted fully isolated package leads heatsink 0.110 min figure 7. screw or clip mounting position for isolation test number 1 *measurement made between leads and heatsink with all leads shorted together. clip mounted fully isolated package leads heatsink clip 0.107 min mounted fully isolated package leads heatsink 0.107 min figure 8. clip mounting position for isolation test number 2 figure 9. screw mounting position for isolation test number 3 mounting information 4-40 screw plain washer heatsink compression washer nut clip heatsink laboratory tests on a limited number of samples indicate, when using the screw and compression washer mounting technique, a screw torque of 6 to 8 in . lbs is sufficient to provide maximum power dissipation capability. the compression washer helps to maintain a constant pressure on the package over time and during large temperature excursions. destructive laboratory tests show that using a hex head 440 screw, without washers, and applying a torque in excess of 20 in . lbs will cause the plastic to crack around the mounting hole, resulting in a loss of isolation capability. additional tests on slotted 440 screws indicate that the screw slot fails between 15 to 20 in . lbs without adversely affecting the package. however, in order to positively ensure the package integrity of the fully isolated device, on semiconductor does not recommend exceeding 10 in . lbs of mounting torque under any mounting conditions. figure 10. typical mounting techniques for isolated package
but11af http://onsemi.com 5 package dimensions case 221d02 issue d to220 fullpak notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. dim a min max min max millimeters 0.621 0.629 15.78 15.97 inches b 0.394 0.402 10.01 10.21 c 0.181 0.189 4.60 4.80 d 0.026 0.034 0.67 0.86 f 0.121 0.129 3.08 3.27 g 0.100 bsc 2.54 bsc h 0.123 0.129 3.13 3.27 j 0.018 0.025 0.46 0.64 k 0.500 0.562 12.70 14.27 l 0.045 0.060 1.14 1.52 n 0.200 bsc 5.08 bsc q 0.126 0.134 3.21 3.40 r 0.107 0.111 2.72 2.81 s 0.096 0.104 2.44 2.64 u 0.259 0.267 6.58 6.78 b y g n d l k h a f q 3 pl 123 m b m 0.25 (0.010) y seating plane t u c s j r
but11af http://onsemi.com 6 notes
but11af http://onsemi.com 7 notes
but11af http://onsemi.com 8 on semiconductor and are trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. atypicalo parameters which may be provided in scill c data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including atypicalso must be validated for each customer application by customer's technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body , or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthori zed use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. publication ordering information central/south america: spanish phone : 3033087143 (monfri 8:00am to 5:00pm mst) email : onlitspanish@hibbertco.com tollfree from mexico: dial 018002882872 for access then dial 8662979322 asia/pacific : ldc for on semiconductor asia support phone : 13036752121 (tuefri 9:00am to 1:00pm, hong kong time) toll free from hong kong & singapore: 00180044223781 email : onlitasia@hibbertco.com japan : on semiconductor, japan customer focus center 4321 nishigotanda, shinagawaku, tokyo, japan 1410031 phone : 81357402700 email : r14525@onsemi.com on semiconductor website : http://onsemi.com for additional information, please contact your local sales representative. but11af/d switchmode a a registered trademark of semiconductor components industries, llc (scillc) north america literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 3036752175 or 8003443860 toll free usa/canada fax : 3036752176 or 8003443867 toll free usa/canada email : onlit@hibbertco.com fax response line: 3036752167 or 8003443810 toll free usa/canada n. american technical support : 8002829855 toll free usa/canada europe: ldc for on semiconductor european support german phone : (+1) 3033087140 (monfri 2:30pm to 7:00pm cet) email : onlitgerman@hibbertco.com french phone : (+1) 3033087141 (monfri 2:00pm to 7:00pm cet) email : onlitfrench@hibbertco.com english phone : (+1) 3033087142 (monfri 12:00pm to 5:00pm gmt) email : onlit@hibbertco.com european tollfree access*: 0080044223781 *available from germany, france, italy, uk, ireland
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